Technological innovation improving the miniaturization, processing speeds and functionality of semiconductors makes possible the production of smaller and lighter digital devices, such as digital cameras and digital video camcorders. To reduce the dimensions of its products, Canon uses various high-density packaging technologies, including Chip Scale Package (CSP), in which solder balls are formed on area-array bonding pads on the back of the package, allowing the package to be bonded to the substrate through heating, and System in Package (SiP), in which semiconductor chips are integrated into a single package. Canon is currently conducting R&D on simulation analysis technologies to enhance the reliability of soldering connections between the package and substrate, and on solder printing technologies, which are essential for high-precision soldering jobs.