Ultraprecision positioning technology is as central to semiconductor manufacture as circuit-miniaturization technology. The positioning precision of the wafer stage that holds silicon wafers affects semiconductor yield rates while stage speed affects productivity, as measured by hourly throughput (productivity). In particular, scanning steppers, in which both the reticle stage and the wafer stage are in motion during exposure, require that both stages move in precise synchronization. High-precision control and manufacturing technologies are needed to provide faster stage speeds while maintaining precision.

For its semiconductor exposure equipment, Canon employs full non-contact coarse- and fine-drive wafer stages. The coarse-drive stage generates no friction because its moving portion floats above the base via a non-contact air guide, enabling high-speed positioning. A drive-reaction force-canceling structure was also adopted. When the moving part of the stage accelerates, a counter mass moves in the opposite direction, canceling the drive reactive force and eliminating drive vibrations to achieve a level of acceleration that previously had not been possible. Lastly, airflow simulations achieve ultraprecise temperature controls in the stage space.

These technologies provide Canon semiconductor exposure equipment with the capacity to scan with high precision at a speed of 500 mm/ second, with an overlay accuracy of less than 10 nm and a high throughput exceeding 100 wafers per hour (122 shots) for 300 mm wafers, and 170 wafers per hour (58 shots) for 200 mm wafers.